About the Coalition

The American Semiconductor Innovation Coalition (ASIC) represents 200 businesses, startups, universities, national labs, and nonprofits dedicated to bringing the best research and development to The National Semiconductor Technology Center and The National Advanced Packaging Manufacturing Program.

Coalition Members Include

Accenture

Advanced Silicon Group

ADVANTEST

Advent Diamond, Inc.

Ajuba

Akoustis, Inc.

Alphawave

Ambature, Inc.

AMD

Analog Devices

Analog Photonics

Anari AI

ANSYS

Applied Materials

Argonne National Laboratory

Arizona State University

ASE Group

ASM

ASML

ASMPT

ASPDL

AT&S

Atomera

Atomica

Auburn University

Austin Community College

BAE Systems

Battelle Memorial

Blue Cheetah Analog

Boston University

Brewer Science, Inc.

BroadPak

BrYet US

Cadence

Cal Poly

Calumet Electronics

Canon Nanotechnologies

Carnegie Mellon University

Caspia

CEA-Leti

Cerfe Labs

City University of New York

Clarkson University

CMC Microsystems

Coherent

Collin’s Aerospace (Raytheon Technologies)

Columbia University

Cornell University

CUNY

Deca Technologies

DPS

Drexel University

Duke University

Dupont

Edwards Vacuum

eFabless

EMD Digital

Entegris

Evatec AG

Exyte

Fermi National Lab

Finwave Semi

Form Factor

Fraunhofer

Free Form Fibers

Frontier Design Automation

Georgia Institute of Technology

GE Research

Global Foundries

Google

GreenSource Fab

Groq, Inc.

Hyperion

IBM

Icahn School of Medicine at Mt. Sinai

Imec

Impact Nano

Indium Corp.

iNEMI

Integra Tech

International Microelectronics Assembly and Packaging Society

Intrinsic

IPC

Jabil, Inc.

JSR Micro

Kinetics

KLA Corporation

KPN Technology

Kyocera SLD Laser

Lam Research

Last Mile Education Fund

Linde

Lux Semiconductor

Marvell

Massachusetts Institute of Technology

Materion

Medtronic

Menlo Microsystems

Mercury Systems, Inc.

Metis MicroSystems

Micron Technology

Microsoft

Mosaic Microsystems

Murata Manufacturing Co Ltd.

Mythic

NanoDX

Nantero

NASA.us LLC

National Institute for Innovation and Technology

NeoLogic

NEPES

NeuReality

New York City Economic Development Corporation

New York State Economic Development Council

New York University

NextFlex

Nhanced Semiconductor

North Carolina Agricultural and Technical State University

North Carolina State University

Northrop Grumman

Notre Dame

NOVA

Novarion Systems

Nubis Communications

Nvidia

NYCREATES

Omni Design Tech

Ohio State University

Palo Alto Electron

PARC

Pasadena Area Community College

PDF Solutions

Pennsylvania State University

Phase Sensitive Innovations

Phlotonics

Photoronics, Inc.

Polar Semiconductor

Portland State University

Precision Innovations

Princeton Plasma Physics Lab

Princeton University

Promex, Inc.

Purdue University

Qorvo, Inc

Qualcomm

Rensselaer Polytechnic institute (RPI)

Rochester Institute of Technology (RIT)

Rutgers

Samsung

Sandbox Semiconductor

San Jose State University

Sara Micro Devices

SCREEN Semiconductor Solutions Co., Ltd

Seagate Tech

SEMI

Semiconductor Industry Association

Showa Denko

Siemens-EDA

SiFive, Inc.

Silicon Box

Silicon Catalyst

SiPhox Inc

SkyWater Technology

Spark Photonics Design

Spark Photonics Foundation

SRC

State University of New York

Steel Perlot

Stevens Institute of Technology

SunRay

Synopsys Inc.

Syracuse University

TechSearch International

TechCet

TEL

Teledyne

Terecircuits

TetraMem

Texas A&M

Texas Instruments

Thermo Fisher

Toppan Photomask

TOK

Travera

TTM Technologies, Inc.

ULVAC

Universal Instruments

University of Arizona

University of California, Davis

University of California, Irvine

University of California, Los Angeles

University of California, San Diego

University of Chicago

University of Dayton School of Engineering

University of Florida

University of Illinois at Urbana-Champaign

University of Maryland

University of Michigan

University of Minnesota

University of Oregon

University of Puerto Rico

University of Rochester

University of Southern California, Viterbi Information Sciences Institute

University of Tennessee, Knoxville

University of Texas

University of Vermont

University of Virginia

University of Wisconsin

Veeco

Ventana Micro Systems

WattsButler LLC

Western Digital

Worcester Polytechnic Institute

Xallent, Inc.

Yale University

Yield Engineering Systems

Yole Development

Zero ASIC

Zestron High Precision Cleaning

3D Glass Solutions