Exciting news for the automotive industry! Join us for a LinkedIn Live event on April 17 at 11 a.m. EST!
Are you ready to revolutionize your automotive soldering processes? Mark your calendars for April 17 at 11 a.m. EST and join Jie Geng for an exclusive LinkedIn Live event about “Low-voiding High-Reliability Lead-free Solder Paste for Automotive Applications,” where he will discuss the game-changing Durafuse® HR (DFHR) lead-free solder paste!

Discover how DFHR, powered by innovative Durafuse® technology, can transform your manufacturing operations with:

✅ **Low Voiding Performance**: Say goodbye to voiding issues! DFHR boasts a void area percentage of less than 15% on thermal pads, significantly lower than traditional SAC305 solder paste, ensuring higher reliability and performance in your automotive applications.

✅ **High Thermal Fatigue Resistance**: Tested under extreme conditions (-40 to 125°C and -40 to 150°C thermal cycling profiles), DFHR demonstrates superior thermal fatigue behavior compared to SAC305 and other high-reliability solder pastes. This means increased durability and longevity for your solder joints, even in the harshest environments.

✅ **Versatile Compatibility**: With a melting temperature range of 205–221°C and compatibility with traditional SAC305 reflow profiles, DFHR seamlessly integrates into your existing manufacturing processes without requiring extensive retooling or adjustments.

✅ **Proven Performance**: Rigorously tested with various components, including CABGA192, QFN (MLF68), and chip resistors (0603 and 1206), DFHR consistently outperforms other solder pastes in shear strength and cross-sectional analysis, ensuring the highest quality and reliability for your automotive products.

Don't miss out on this opportunity to stay ahead of the curve in the automotive industry! Register now to secure your spot and gain valuable insights into the future of soldering technology. See you there!