This webinar will focus on optimizing two of the most important areas of the SMT assembly process, printing & reflow. To obtain a high yield process with a low defect rate, both the printing and reflow process must be fully understood and finetuned to work with the materials being used for assembly. In this seminar Sbiroli will discuss:

• Printed circuit board assembly (PCBA) material’s selection & optimization (solder paste & board design)
• Proper storage & handling techniques
• Stencil selection
• Stencil printer setup
• Common solder paste printing defects & how to overcome
• Designing a reflow profile for low voiding & high reliability
• Understanding & mitigation of common reflow related defects including voiding, head-in-pillow (HiP), non-wet opens (NWO), graping & tombstoning

A question & answer session will be held at the end of the presentation. Please bring your SMT process challenges to discuss with the presenter. Sbiroli has almost 30 years’ experience related to SMT materials & process optimization.

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In Design Considerations for Board Layout and Material Selection, Sjoberg and Marques will discuss how implementing high-density SMTA assemblies in electronic products require many considerations. Previously, high-density SMTA assemblies were primarily used in mobile phones and consumer electronics. However, the rapid growth of EVs and more sophisticated electronics on all types of automobiles shows that these high-density assemblies are not being fully adapted into the automotive market. Before starting any developmental work or implementing a new technology, it is critical to understand the products, their capabilities, and industry requirements. If these are not fully understood, failure is the most probable outcome.

This presentation will discuss conducting DfX based on end-product requirements and the need to perform proper root cause analyses before making any material or process changes.

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Increased Reliability for Higher Mission Profiles in Automotive Electronics,Enhanced automotive electrification has resulted in increased mission profiles (more cycles, higher service temperatures) for PCB assemblies as well as power modules (for inverters). The solder joints experience greater thermo-mechanical loads and there will be instances where traditional SAC solder alloys may not be able to fulfill more stringent product lifetime validation requirements. Therefore, the choice of solder materials becomes more critical as they have to check multiple design requirements – (a) increased hardness to compensate for creep under stress with increased temperatures; (b) balancing hardness with the right amount of ductility so as to not transmit the stress elsewhere; (c) ensuring that the alternate solder alloy can be processed in the same window used for SAC solders. Less

Since the early days of SMT assembly, one of the most persistent defects with the greatest longevity is voiding in solder joints. Other defects – such as graping, head-in-pillow, and non-wet opens – have known solutions, but voiding remains largely unsolved and with each technology inflection seems to make a strong comeback. The increased use of bottom-terminated components (BTC), high-density electronics, and high-reliability alloys needed for today’s automotive applications has resulted in a renewed focus on voiding reduction. Voiding in solder bumped components (e.g., BGAs and CSPs) and BTCs (including QFNs and DPAK) each have their own unique cause and mitigation techniques. To consistently maintain an acceptable level of voiding per industry standards and self-imposed levels due to stringent in-use requirements, a detailed understanding of the unique causes of voiding and process mitigation techniques is needed. This session will review the cause and effect relationship between voiding and the soldering materials used in today’s electronics assemblies. We will also review material and process solutions to maintain acceptable levels of voiding in various forms of SMT assembly. Less

Due to changes in the operating conditions of electronic assemblies, new mission profiles are constantly needed for lifetime reliability. These also increase the demands on the materials used in assemblies. In the area of “no-clean” solder pastes, the focus is on the Surface Insulation Resistance (SIR) test as proof of the electrochemical duration reliability of these flux residues. For example, today’s existing test duration has increased from 168 hours to 1,000 hours (+600%). Some flux systems in solder pastes already have solutions to these new challenges. Less